Model Lineup
TR-100 series
TR-100 series achieves high accuracy and high speed. Flexibly supports development, prototyping, mass production by combining units. It can handle a wide variety of workpieces.
- Applications: LED chip, IC, sensor mounting
| Bonding speed |
0.75 seconds / cycle |
| Bonding accuracy |
XY: ±5 μm θ: ±0.5 ° |
| Bonding area |
MAX: 300×100 |
LD manufacturing equipment
【KFA-11】
LD manufacturing equipment common to LD chip and PD chip.
【PD die bonder】
High-accuracy die bonder to mount PD chips.
- Applications: LD manufacturing
Resin coating equipment
A resin coating device is a device that injects a certain amount of resin into packages such as LED substrates using a dispenser.
The transport system is a type with an XY stage and a loader/unloader.
- Applications: LED substrate